On September 6, 2026, Shenzhen-based Rayson Technology officially unveiled a new LPDDR5X LPCAMM2 memory module available in a single-stick 96GB capacity with a data transfer rate of 9600MT/s. This compact module measures just 78×23×3mm, cutting board space usage by roughly 60% compared to traditional DDR5 SO-DIMM form factors, while also reducing power consumption by about 50% and boosting energy efficiency by approximately 70%.
The product has already passed platform adaptation and validation with leading international PC OEMs, confirming its compatibility across a range of high-end laptops and workstations. In addition to the flagship 96GB configuration, Rayson is also offering 16GB, 32GB, and 64GB capacity variants to address diverse memory requirements in the growing AI PC segment.
This launch positions Rayson as a key player in the push toward next-generation memory solutions, particularly as AI-driven applications demand increasingly higher bandwidth, lower latency, and more energy-efficient memory architectures. With LPCAMM2 gaining traction as a standardized low-power compression-attached memory module format, the new offering is expected to accelerate the adoption of LPDDR5X in thin-and-light laptops, mini PCs, and edge computing devices.
Engineered for high-performance workloads, the module leverages advanced packaging and signal integrity design to sustain reliable operation at extreme transfer speeds, even under thermally constrained chassis conditions. IT decision-makers and system integrators targeting AI inference, real-time data processing, or large language model workloads will benefit from the combination of high density and reduced footprint.
Rayson’s roadmap indicates further expansions into ultra-high-capacity modules and integration with next-gen CPU/GPU platforms. The company emphasized that its validation process involved rigorous stress testing across multiple operating systems and firmware environments to ensure seamless plug-and-play deployment for commercial customers.
As AI PC shipments continue to rise, the need for scalable, low-power, and space-efficient memory becomes critical. This new LPCAMM2 series directly addresses that gap, giving designers and end users the capability to run memory-intensive applications without compromising battery life or internal real estate. Expected to sample in Q4 2026, the modules will initially target premium laptops, mobile workstations, and compact desktop form factors before broadening into enterprise and industrial applications.
